
Palladium-Nickel Electroplating
Palladium-Nickel Electroplating refers to coating with a precious Palladium-Nickel alloy, created by combining Palladium with Nickel in a variety of chemical ratios. The ratio of Nickel to Palladium varies to provide fine-tuned performance results optimal for specific applications. However, all the ratios of this alloy are generally selected because they deliver the sought-after performance qualities for which Nickel is known. With some minor adjustments in plating specifications, Palladium-Nickel is often used as a cost-efficient alternative to Gold Plating.
Summit electroplates using Palladium-Nickel to deliver many performance advantages:
- Palladium-Nickel is more affordable than gold
- Palladium-Nickel delivers excellent ductile resistance
- Palladium-Nickel has a low density and offers excellent solderability
- Palladium-Nickel is harder the majority most gold plating chemistries
- Palladium-Nickel offers great heat and stress resistance
- Palladium-Nickel offers excellent corrosion and oxidation resistance
- Palladium-Nickel reduces usage of precious metal resources
Palladium Nickel plating that meets tight industry specs
Electroplating with Palladium-Nickel at Summit provides both overall coverage and selective coverage to meet required specifications that include ASTM B867. Within this specification, we offer a range of chemistry ratios:
- ASTM B867 | Type I: made of 75% Palladium 75% and 25% Nickel
- ASTM B867 | Type II: made of 80% Palladium and 20% Nickel
- ASTM B867 | Type III: made of 85% Palladium and 15% Nickel
- ASTM B867 | Type IV: made of 90% Palladium and 10% Nickel
Plating thicknesses to meet application needs.
The thickness of Summit’s Palladium-Nickel Electroplating corresponds to the specified end application. Thinner coatings are generally used for delicate electronic circuits and connectors — thicker coatings are required on parts subject to intense electrical, mechanical, and environmental activity.
Enhancing Palladium Nickel plating with secondary coatings
Underplating with Palladium-Nickel
Underplating with Nickel prior to plating with a Palladium-Nickel alloy provides a protective corrosion inhibiting barrier. This barrier helps prevent the migration porous base substrates like copper from diffusing through to the Palladium-Nickel layer.
Overplating with Palladium-Nickel
Summit can also combine Palladium-Nickel with a gold flash overcoat. This dual process delivers the enhanced conductivity and friction-free characteristics of gold — all with significant cost savings compared to thicker gold plating.
A plating alloy as versatile as the industries it serves
The durable, functional, affordable characteristics of Palladium-Nickel Plating make it a popular, economical choice for electrical contacts, connectors, pins, circuits and components used in Aerospace, Telecom, Medical, Oil & Gas, and other inportant Electronics technology. For companies looking to cut cost without cutting spec-meeting performance, the answer just might be Sunnit Plating’s Palladium-Nickel Electroplating!
Summit Palladium-Nickel capabilities at a glance
Contact Summit Plating
Learn how Summit Plating can improve your bottom line — contact us by phone or email to request a no hassle QUOTE today! We look forward to assisting you.

“We appreciate your trust, respect your time, and look forward to helping you discover a better electroplating solution for your next project!”
Leeza Day —
Management, Summit
(860) 283-4391
fax (860) 283-4010

1430 Waterbury Road
Thomaston, CT 06787