Tin Electroplating of Round Wire

Tin Electroplating of wire at Summit Plating is an economical solution for improving connective usability and durability.

Tin Electroplating characteristics

Tin electroplating enhancements include increased operating temperature range and improved solder-ability. Tin plating on certain wires, (especially Copper) does have a limited solder-ability shelf-life due to an inter-metallic interaction that naturally occurs over time between the base wire and the tin coating. If considering this option, it should be noted that proper packaging can significantly extend the shelf life of Tin Plated Wire.

Tin Electroplating Capabilities

Wire Diameter: .005"-.300"
Specifications: MIL-T-10727 | ASTM B 545 | MIL-P-81728
Base Material: Cu, BeCu, Copper Alloys, Phos Bronze, Brass, Stainless Steel, Steel, Aluminum, Inconel, Kovar, Monel, Waspaloy, Hastelloy
Coating Thickness: FLASH-.002"
Finishes: Matte, Semi-Bright, Bright

Contact Summit Plating

The best way to learn how Summit Plating can improve your bottom line is to contact us by
phone or email...or request a QUOTE! We look forward to assisting you today!

“We appreciate your trust, respect your time, and look forward to helping you discover a better electroplating solution for your next project!”
Leeza Day —
Management, Summit


1430 Waterbury Road
Thomaston, CT 06787

(860) 283-4391

fax: (860) 283-4010

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