Tin and Nickel Electroplating of Round Wire
Tin and Nickel Electroplating of wire provides economical enhancements that can improve connective usability and durability.
Tin Electroplating characteristics
Tin electroplating enhancements include increased operating temperature range and improved solder-ability. Tin plating on certain wires, (especially Copper) does have a limited solder-ability shelf-life due to an inter-metallic interaction that naturally occurs over time between the base wire and the tin coating. Proper packaging can extend this shelf life.
Nickel Electroplating characteristics
Nickel Electroplating increases both operating temperature and solder-ability characteristics of wire at a performance level much greater than that of Tin Electroplating. Nickel plating wire also provides significantly greater resistance to corrosion from external elements. Because of Nickel’s hardness characteristics, flux activation is required to create effective soldered connections.