Dual Coating Electroplating on Wire

Dual-coat and multi-coat electroplating of wire at Summit Plating is a process that provides a protective inner barrier to enhance or maintain function. Dual coat (or multi-layer) electroplating allows the outer plating surface metal to retain important performance characteristics that might otherwise be compromised by inter-metallic interaction between the base wire and outer plating.

Dual Coat Electroplating can also be administered to increase electrical conductivity, retain solder-ability, improve corrosion and wear resistance, and more.